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Basic Info.
Packaging & Delivery
Product Description
We are a supplier of customized alumina ceramic substrates. Our products are environmentally friendly, highly stable, corrosion-resistant, high-temperature resistant and with accurate dimensions. If you need alumina ceramic substrates, please choose Jinghui Ceramic for fast production and delivery!
Alumina ceramic is the most common substrate material you'll find in today's printed circuit boards. It boasts an excellent balance of thermal and electrical conductivity when compared to other oxide ceramic substrates.
The alumina ceramic substrate is also reputed for better mechanical strength and chemical stability and is readily available. These properties make it the ideal option for technical manufacturing, especially when various shapes have to be considered. If used in circuit boards, the purity of alumina is usually 96% or 99.6%.
Below we will focus on the 96% alumina ceramic substrates. If you are interested in 99.6% alumina, please contact us to learn more.
1. Product Specification
We can produce a variety of specifications and the table below shows our standard thicknesses and sizes.
| 96% Alumina Ceramic Substrate | |||||||
| Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
| As Fired | Lapped | Polished | Rectangular | Square | Round | ||
| 0.25 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.3 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.38 | 140×190 | √ | Tape Casting | ||||
| 0.5 | 140×190 | √ | Tape Casting | ||||
| 0.635 | 140×190 | √ | Tape Casting | ||||
| 0.76 | 130×140 | √ | Tape Casting | ||||
| 0.8 | 130×140 | √ | Tape Casting | ||||
| 0.89 | 130×140 | √ | Tape Casting | ||||
| 1 | 280×240 | √ | Tape Casting | ||||
| 1.5 | 165×210 | √ | Tape Casting | ||||
| 2 | 500×500 | √ | Tape Casting | ||||
| Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping. | |||||||
2. Product Tolerances
| 96% Alumina Ceramic Substrate | ||||
| Item | Substrate Thickness (mm) | Standard Tolerance (mm) | Best Tolerance (mm) | Laser Cutting Tolerance (mm) |
| Length and Width Tolerance | / | ±2 | ±0.15 | |
| Thickness Tolerance | T<0.3 | ±0.03 | ±0.01 | |
| 0.30-1.0 | ±0.05 | ±0.01 | ||
| T>1.0 | ±10% | ±0.01 | ||
3. Surface Roughness
| 96% Alumina Ceramic Substrate | ||
| Surface Roughness (μm) | ||
| As Fired | Lapped | Polished |
| Ra 0.2-0.75 | Ra 0.3-0.7 | Ra ≤0.05 |
4. Laser Processing
(1) Hole Size
| 96% Alumina Ceramic Substrate | |
| Hole Diameter (mm) | Standard Tolerance (mm) |
| φ≤0.5 | 0.08 |
| φ>0.5 | 0.2 |
(2) Laser Scribing
| 96% Alumina Ceramic Substrate | |
| Substrate Thickness (mm) | Laser Scribe Line Depth to Thickness (%) |
| 0.2-0.3 | 40%±5% |
| 0.3<T≤0.5 | 50%±3% |
| 0.5<T≤1.0 | 43%±3% |
| 1.2 | 55%±3% |
| 1.5 | 55%±3% |
| 2.0 | 55%+10% |
| The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm. | |
| 96% Alumina Ceramic Substrate | |||
| Item | Unit | 96% Al2O3 | |
| Mechanical Properties | |||
| Color | / | / | White |
| Density | Drainage Method | g/cm3 | ≥3.70 |
| Light Reflectivity | 400nm/1mm | % | 94 |
| Flexural Strength | Three Point Bending | MPa | >350 |
| Fracture Toughness | Indentation Method | MPa·m1/2 | 3.0 |
| Vickers Hardness | Load 4.9N | GPa | 14 |
| Young's Modulus | Stretching Method | GPa | 340 |
| Water Absorption | % | 0 | |
| Camber | / | Length‰ | T≤0.3: ≤5‰, Others: ≤3‰ |
| Thermal Properties | |||
| Max. Service Temperature (Non-loading) | / | ºC | 1200 |
| CTE (Coefficient of Thermal Expansion) | 20-800ºC | 1×10-6/ºC | 7.8 |
| Thermal Conductivity | 25ºC | W/m·K | >24 |
| Thermal Shock Resistance | 800ºC | ≥10 Times | No Crack |
| Specific Heat | 25ºC | J/kg·k | 750 |
| Electrical Properties | |||
| Dielectric Constant | 25ºC, 1MHz | / | 9.4 |
| Dielectric Loss Angle | 25ºC, 1MHz | ×10-4 | ≤3 |
| Volume Resistivity | 25ºC | Ω·cm | ≥1014 |
| Dielectric Strength | DC | KV/mm | ≥15 |
Jinghui Ceramic offers bare ceramic substrates in various raw materials, sizes, shapes and thicknesses.
