Product Description

Meet the Hoosun Precision SMD 25 Grinding Machine, your smart solution for grinding micro and nano materials. Designed for precision and efficiency, this machine ensures top-quality standards in your manufacturing processes.

Performance Advantages

1. High Precision Lapping: Achieve a uniform and smooth surface finish critical for SMD components, thanks to advanced lapping technology.
2. Automated Control: Simplify operations and minimize errors with our automated control system.
3. Customizable Settings: Easily adjust pressure, speed, and duration to meet specific material needs.
4. Durable Construction: Built with high-quality materials for long-lasting performance in tough environments.
5. User-Friendly Interface: Manage with ease using an intuitive control panel, boosting productivity.

Technical Specifications:

• Fineness: 100nm - 10μm
• Zirconia Bead Diameter: 0.1-0.6mm
• Separation System: Sieve Separation
• Optional Materials: Tungsten carbide, Polyurethane, Zirconia, Silicon carbide, Silicon nitride

Efficiency Highlights:

• Ultrafine Grinding: Achieve fineness below 200μm with 2-3 times the output of ordinary sand mills.
• Independent Operation: Separate material grinding and separation for precise results.

Applications:

• Nano materials, MLCC, Lithium batteries, Silicon carbon electrodes, Alumina, Ceramic inks

Why Choose Hoosun?

• Precision: Ensure exact specifications with advanced lapping.
• Automation: Streamline your processes and reduce errors.
• Flexibility: Customize settings for diverse material needs.
• Durability: Invest in a robust machine built to last.
• Ease of Use: Increase productivity with a user-friendly interface.

Equipment Specifications: