Basic Info.
Model NO.
NN-175655
Coefficient of Thermal Expansion
4.8
Thermal Conductivity
(25°c) 180 W/Mk
Water Absorption
0
Processing Service
Moulding
Density
3.31g/cm3
Melting Point
2500
Type
Plate
Transport Package
Standard Safety Cartons with Plastic Foams
Specification
Customized
Trademark
INNOVACERA
Origin
Fujian, China
Production Capacity
2000 Piece/Pieces Per Month
Product Description
The aluminum nitride (AlN) ceramic has high thermal conductivity(5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance ,and the linear expansion coefficient is similar with Si,which is widely used in communication components, high power led, power electronic devices and other fields.Special spec products can be produced upon requests.
Aluminum Nitride Ceramic Substrates has a well equipped and modern tool room dedicated to the manufacture and maintenance of customers tooling. By keeping this process in house we are able to keep not only simple but extremely complex tooling costs to a minimum, coupled with shorter lead times.
Aluminum Nitride Ceramic Substrates has a well equipped and modern tool room dedicated to the manufacture and maintenance of customers tooling. By keeping this process in house we are able to keep not only simple but extremely complex tooling costs to a minimum, coupled with shorter lead times.
Regular specification of AlN substrate and wafer size:
| Thickness(mm) | L*W( mm) | |||||||
| 0.385 | 2″* 2″ 50.8mm*50.8mm | 3″* 3″ 76.2mm*76.2mm | 4″* 4″ 101.6mm*101.6mm | 4.5″* 4.5″ 114.3mm*114.3mm | ||||
| 0.5 | ||||||||
| 0.635 | ||||||||
| 1 | ||||||||
| Thickness(mm) | Diameter(mm) | |||||||
| 1 | Φ16 Φ19 | Φ20 Φ26 | Φ30 Φ35 | Φ40 Φ45 | Φ50 Φ52 | Φ60 | Φ75 | Φ80 |
| 1.2 | ||||||||
| 1.5 | ||||||||
| 2 | ||||||||
| 2.5 | ||||||||
AlN ceramic substrate features:
1) Wear -resisting
2) Resistant high temperatures
3) Good chemical stability
4) Electrical insulator
5) Hardness and low thermal expansion
6) It is widely used for power electronic devices.
7) High thermal conductivity
8) High heat conductivity
1) Wear -resisting
2) Resistant high temperatures
3) Good chemical stability
4) Electrical insulator
5) Hardness and low thermal expansion
6) It is widely used for power electronic devices.
7) High thermal conductivity
8) High heat conductivity
| Aluminium Nitride Material Properties | ||||
| Material | ALN | |||
| Item No. | INC-AN180 | INC-AN200 | INC-AN220 | |
| Color | Gray | Gray | Beige | |
| Main Content | 96%ALN | 96%ALN | 97%ALN | |
| Main Characteristics | High Thermal Conductivity,Excellent Plasma Resistance | |||
| Main Applications | Heat Dissipating Parts,Plasma Resistance Parts | |||
| Bulk Density | 3.30 | 3.30 | 3.28 | |
| Water Absorption | 0 | 0 | 0 | |
| Vickers Hardness(Load 500g) | 10.0 | 9.5 | 9. | |
| Flexural Strength | >=350 | >=325 | >=280 | |
| Compressive Strength | 2500 | 2500 | - | |
| Young' Modulus of Elasticity | 320 | 320 | 320 | |
| Poisson's Ratio | 0.24 | 0.24 | 0.24 | |
| Fracture Toughness | - | - | - | |
| Coefficient Linear Thermal Expansion | 40-400degree | 4.8 | 4.6 | 4.5 |
| Thermal Conductivity | 20degree | 180 | 200 | 220 |
| Specific Heat | 0.74 | 0.74 | 0.76 | |
| Thermal Shocking Resistance | - | - | - | |
| Volume Resistivity | 20degree | >=10-14 | >=10-14 | >=10-13 |
| Dielectric Strength | >=15 | >=15 | >=15 | |
| Dielectric Constant | 1MHz | 9 | 8.8 | 8.6 |
| Loss Tangent | *10-4 | 5 | 5 | 6 |
