- Overview
- Products Description
Basic Info.
Size
Customer′s Drawing
Color
Black
Heat Conductivity Coefficient
100-140W/M.K
Insulating Property
15kv/mm
Water Absorption
0 %
Density
≥3.32g/cm3
Advantage
Corrosion Resistance
Product Name
Aluminum Nitride
Certificate
RoHS
Transport Package
Carton Packing
Specification
Customized
Trademark
IINNOVACERA
Origin
Fujian, China
Production Capacity
200000 Piece/Pieces Per Month
Product Description
Hot pressed aluminum nitride (AlN) is used in applications requiring high electrical resistivity in additional to exceptional thermal conductivity. The applications for hot pressed AlN typically involve rigorous or abrasive environments and high-temperature thermal cycling.
Hot Pressed Alumina Nitride Properties:
| Property | Units | Value |
| Flexural Strength, MOR (20 °C) | MPa | 300-460 |
| Fracture Toughness | MPa m1/2 | 2.75-6.0 |
| Thermal Conductivity (20 °C) | W/m K | 80-140 |
| Coefficient of Thermal Expansion | 1 x 10-6/°C | 3.3-5.5 |
| Maximum Use Temperature | °C | 800 |
| Dielectric Strength (6.35mm) | ac-kV/mm | 16.0-19.7 |
| Dielectric Loss | 1MHz, 25 °C | 1 x 10-4 to 5 x 10-4 |
| Volume Resistivity (25°C) | Ω-cm | 1013 to 1014 |
Features
>High thermal conductivity
>Expansion coefficient can match with semiconductor silicon chips
>High insulation resistance and voltage withstand strength
>Low dielectric constant and low dielectric loss
>High mechanical strength
>High thermal conductivity
>Expansion coefficient can match with semiconductor silicon chips
>High insulation resistance and voltage withstand strength
>Low dielectric constant and low dielectric loss
>High mechanical strength